| 摘要 |
PROBLEM TO BE SOLVED: To provide a potting structure of a small substrate assembly which can be readily housed and attached in a product casing in high precision without using a case for sealing a potting agent, and has favorable electric performance and manufacturing property, and to provide a method of manufacturing the same. SOLUTION: Both surfaces of two opposed edge portions of a printed wiring board are exposed so that the substrate can be inserted to a substrate guide and readily attached in high precision.
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