发明名称 |
Multi-layer laminated film |
摘要 |
A multi-layer laminated film includes layers composed using a thermoplastic resin A and layers composed using a thermoplastic resin B, which A layers and B layers are alternately laminated in 51 or more layers, wherein the film has: a heat shrinkage stress of 0.5 MPa to 5 MPa at 150° C. in the longitudinal and width directions of the film; and a heat shrinkage stress kick-off temperature of 110° C. or lower in at least one of the longitudinal and width directions of the film. |
申请公布号 |
US9527266(B2) |
申请公布日期 |
2016.12.27 |
申请号 |
US201314385235 |
申请日期 |
2013.03.13 |
申请人 |
Toray Industries, Inc. |
发明人 |
Matsuo Yuji;Uto Takayuki;Osada Syunichi;Goda Wataru |
分类号 |
B32B27/36;B32B17/10;B32B7/02;G02B1/04;G02B5/28;B32B27/08 |
主分类号 |
B32B27/36 |
代理机构 |
DLA Piper LLP (US) |
代理人 |
DLA Piper LLP (US) |
主权项 |
1. A multi-layer laminated film comprising layers composed of a crystalline thermoplastic resin A (A layers) and layers composed of a non-crystalline thermoplastic resin B as a major component (B layers), which A layers and B layers are alternately laminated in 51 or more layers, wherein the multi-layer laminated film is biaxially stretched in the longitudinal and transverse directions at a temperature from 80° C. to 120° C. with a draw ratio of 2 to 6 for each direction, heat-treating the film at a temperature from 160° C. to 220° C., and subjecting the heat-treated film to cooling at a temperature that is 80° C. of higher; and wherein said film has:
a heat shrinkage stress of not less than 0.5 MPa and not more than 5 MPa at 150° C. in longitudinal and width directions of said film; and a heat shrinkage stress kick-off temperature of 110° C. or lower in both the longitudinal and width directions of said film, said heat shrinkage stress kick-off temperature being defined as, in a heat shrinkage stress curve determined under a condition where temperature is 25° C. to 200° C. and a heating rate is 5° C./min, the temperature at an intersection between a baseline preceding an initial rise of said heat shrinkage stress curve and a tangent line drawn at a point where said heat shrinkage stress curve has a maximum slope after said initial rise. |
地址 |
JP |