Acoustic microscopy die crack inspection for plastic encapsulated integrated circuits

摘要

A novel method of non-destructive die crack inspection of a plastic encapsulated integrated circuit (PEIC) uses a scanning acoustic microscope, such as a C-mode scanning acoustic microscope. To generate scan of a die surface of the PEIC, the width of a data gate of the microscope is set to scan only the die surface. Then, the data gate is moved to cover only die subsurface reflection area on a screen of the microscope, and scan of the die subsurface is generated.