发明名称 SUBSTRATE CARRYING BLADE AND SEMICONDUCTOR SUBSTRATE MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress the sticking of particles by centering a substrate without giving an impact at the time of the contact of a carrying blade and the end of the substrate. SOLUTION: This substrate carrying blade is for mounting and carrying the substrate 11, a recessed part 20 for mounting the substrate 11 is provided on a bottom surface whose diameter is the same as the substrate 11, and inclined bases 14-17 having a slope turned to the inner direction of the recessed part 20 are provided on the peripheral part of the recessed part 20 so as to be partially in contact with the end of the substrate 11. Thus, when the substrate 11 is mounted on the carrying blade, since the peripheral part of the substrate 11 slides down to the center of the recessed part while being in almost point contact with them and positioned, the impact to be given to the end of the substrate 11 is minimized and the sticking of the particles on the substrate 11 is suppressed.
申请公布号 JP2002141389(A) 申请公布日期 2002.05.17
申请号 JP20000331836 申请日期 2000.10.31
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HORIE SHINICHI
分类号 B25J15/08;B65G49/07;C23C14/50;C23C16/44;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B25J15/08
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