| 摘要 |
PURPOSE: A method for automatically eliminating tape attached to a wafer frame is provided to improve productivity, by sequentially taking wafer frames out of a magazine one by one, by automatically removing the tape from the wafer frame and by sequentially loading the wafer frames to a loading unit. CONSTITUTION: Magazines(4) into which the wafer frames are sequentially inserted are sequentially settled in a settle plate(7) of an elevator unit(6). The wafer frames are sequentially taken from the magazine settled in the settle plate and are positioned in a loading position(8). The frame positioned in the loading position is transferred to a tape removing unit(11) by a transfer(9). The tape removing unit pressures the tape so that the tape is eliminated from the wafer frames while being folded in two. The folded tape is pressured to crush a defective chip and the crushed defective chip is exhausted. The transfer transfers the wafer frame from which the tape is removed to an unloading position(12) and is loaded while the defective chip is crushed.
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