发明名称 ELECTRONIC CIRCUIT CHIP
摘要 PROBLEM TO BE SOLVED: To secure an I/O pad for a test having a size same to an I/O pad used usually, on a circuit chip as required. SOLUTION: In this circuit chip 1, the I/O pad 11 for the test having a surface area same or substantially same to the I/O pad 12 usually used is also formed within a circuit arranging area 13 in which an electronic circuit is formed.
申请公布号 JP2002168919(A) 申请公布日期 2002.06.14
申请号 JP20000368171 申请日期 2000.12.04
申请人 SONY CORP 发明人 MATSUSHIMA SHINYA
分类号 G01R31/28;H01L21/822;H01L27/04;(IPC1-7):G01R31/28 主分类号 G01R31/28
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