发明名称 THREE-DIMENSIONAL IMAGE SENSING MODULE WITH A LOW Z-HEIGHT
摘要 Disclosed is a three-dimensional image sensing module with a low z-height, and a process for forming the same. The three-dimensional image sensing module may include two or more cameras to capture image data, where each camera includes a lens holder having at least one optical camera lens. Furthermore, the three-dimensional image sensing module may also include a spacer attached to a top side of the lens holders of the two or more cameras that provides dimensional stability for the relative positioning of the two or more cameras with respect to one another.
申请公布号 US2016381262(A1) 申请公布日期 2016.12.29
申请号 US201514747887 申请日期 2015.06.23
申请人 Intel Corporation 发明人 Shi Wei
分类号 H04N5/225;G02B13/00;G02B5/20;H04N13/02 主分类号 H04N5/225
代理机构 代理人
主权项 1. A three-dimensional image sensing module, comprising: two or more cameras to capture image data, each camera comprising a lens holder having at least one optical camera lens; and a spacer attached to a top side of the lens holders of the two or more cameras that provides dimensional stability for the relative positioning of the two or more cameras with respect to one another.
地址 Santa Clara CA US