Semiconductor package with heat dissipating element

摘要

A semiconductor package with a heat dissipating element is proposed, in which the contact area between a semiconductor chip and the heat dissipating element is significantly reduced as the chip merely has its edge portion attached to the dissipating element. This makes an effect of a thermal stress on the chip reduced so as to prevent cracking and delamination for the chip. Moreover, the chip is partially exposed to the atmosphere, which allows the efficiency of heat dissipation and moisture escapement to be improved, so as to prevent a popcorn effect from occurrence and make the semiconductor package assured in reliability and quality.