SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: To provide a semiconductor device which has a contact hole opened by self alignment and which can suppress a contact resistance while preventing short-circuiting between a wiring and a contact plug. CONSTITUTION: A contact plug 26 is formed by self alignment between adjacent wirings 14. An interlayer oxide film 12 is formed on a substrate layer 10 conducted with a bottom surface of the contact plug. A lower insulating film 32 made of a nitride-based insulating film is provided to cover the entire surface of the interlayer oxide film 12, except for a part corresponding to the contact hole. A wiring 12, an upper insulating film 16 made of a nitride-based insulating film, and a sidewall 18 made of a nitride-based insulating film are provided on the lower insulating film 32. The contact hole has a diameter larger than an interval between the wirings 14 in the same layer as the interlayer oxide film 12.