| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a reduction in the risk that bonding wires are short-circuited and an improvement in reliability. SOLUTION: The semiconductor device 201 comprises a wiring board 106, a lower-stage semiconductor device 107 stuck onto the wiring board 106, a wiring relay member 206 stuck onto the lower-stage semiconductor device 107, an upper-stage semiconductor device 108 stuck onto the wiring relay member 206, a first bonding wire 203 for electrically connecting the wiring board 106 and the lower-stage semiconductor device 107, a second bonding wire 207 for electrically connecting the upper-stage semiconductor device 108 and the wiring relay member 206, a third bonding wire 204 for electrically connecting the wiring relay member 206 and the wiring board 106, and a sealing resin 110 for sealing the first to third bonding wires 204. In the semiconductor device 201, the wiring relay member 206 electrically connects the second bonding wire 207 and the third bonding wire 204. |
