| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board which can produce a printed wiring board with stable quality, where outgas is not generated in the case of mounting and flatness is superior, in order to improve bonding strength of wire bonding. SOLUTION: In this method for manufacturing a printed wiring board, a circuit pattern 3 is formed by an etching method on an insulating film with a copper foil which is formed by sticking an adhesive layer 2 formed on an insulating film 1 surface, having flexibility on a copper foil and curing them, solder resist 4 having insulation and an arbitrary pattern is spread on a circuit pattern surface and cured, and a plated film is formed on the circuit pattern surface exposed from the solder resist. Before at least the plated film is formed, heat treatment is conducted in a vacuum and cleaning is performed by using alkaline solution. |
