Liquid-cooled power semiconductor device heatsink

摘要

The present invention relates to a cold plate for cooling electronic components comprising a base having a top surface onto which at least one electronic component is to be placed; a cooling well formed in the top of the base and open at the top; a feed channel formed in the base for carrying fluid into the cooling well; a drain channel formed in the base for carrying cooling fluid away from the cooling well; cooling well inlets and outlets formed in the cooling well and in communication with the feed channel and drain channels, respectively. The feed and drain channels are sufficiently large relative to the size and flow characteristics of the well and cooling well inlets and outlets such that when the cooling fluid flows through the device, the pressure drop across the feed channel is substantially less than the pressure drop across the well.