| 摘要 |
PROBLEM TO BE SOLVED: To arrange an IC chip closer to a connection terminal on a base than in the conventional practice and to make a piezoelectric device smaller by reducing the dimensions of the base in a longitudinal direction. SOLUTION: A piezo-oscillator, in which a piezoelectric vibrating reed 16 and the IC chip 17 are sealed hermetically within a package having a base 13 and a cover 14 connected to the base 13, is provided with a package structure in which the IC chip is mounted on the base, the electrode pads 22a and 22b of the IC chip 17 are electrically connected by the lead terminals 23a and 23b of the base and wire bonding 24a and 24b, and the piezoelectric vibrating reed is supported by the connection terminal 20 of the base at the base end part 16a in cantilever to be electrically connected in an upper part of the IC chip. The electrode pad 22a of the IC chip connected electrically to the piezoelectric vibrating reed and the lead terminal 23a of the base are arranged on a side opposite to that of the connection terminal in a longitudinal direction. |
