发明名称 |
Arrangement used in the manufacture of matrix displays comprises a substrate having a recess, and a chip provided in the recess with a layer formed on the peripheral surface of the recess and/or chip |
摘要 |
Arrangement comprises a substrate (1) having at least one recess (3); and at least one chip (2) provided in the recess. At least one of the peripheral surfaces of the chips protruding into the recess and/or at least one peripheral surface of the recess has a layer formed in such as way that an attraction produced on placing the chip in the recess is amplified between the chip and recess. An Independent claim is also included for a process for the production of the arrangement. Preferred Features: The layer formed on the chip and/or in the recess is structured. The layer is monomolecular and hydrophobic. The layer is treated with silanes or thiolenes.
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申请公布号 |
DE10105872(A1) |
申请公布日期 |
2002.09.05 |
申请号 |
DE2001105872 |
申请日期 |
2001.02.09 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
JUNG, STEFAN;SCHMID, GUENTER;WEBER, WERNER;WIEDER, ARMIN |
分类号 |
H01L21/98;H01L23/13;H01L25/075;H01L27/15;H01L29/06;H01L33/20;H01L33/24;(IPC1-7):H01L25/075;B81B7/00;H01L21/58 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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