| 摘要 |
PROBLEM TO BE SOLVED: To prevent a defective soldering by forming a round solder attracting land upstream the solder flow direction surrounding a through hole on the component surface, when moving the component surface and a solder surface of a double-sided printed wiring board in contact with the solder in a solder bath to electrically connect the component surface and the solder surface using a jumper wire. SOLUTION: The double-sided printed wiring board comprises a board 10 formed with a through hole 13, jumper wire 11 inserted into the through hole 13, a circular land 12 disposed on the upper surface of the board so as to surround the through hole 13, and solder attracting land 12 disposed upstream the solder flow direction. The component surface of the board member which is to be mounted with a component and the solder surface to which the component is fixed and electrically connected are moved in contact with the solder in the solder bath to form a solder fillet 16 at the circular land 12 via the solder attracting land 14.
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