发明名称 |
Nested plug-in modules |
摘要 |
A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
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申请公布号 |
US2002131249(A1) |
申请公布日期 |
2002.09.19 |
申请号 |
US20020144619 |
申请日期 |
2002.05.13 |
申请人 |
GENERAL INSTRUMENT CORPORATION |
发明人 |
FREDERICK STEVEN F.;SMEDLEY KIMBERLEY A.;GEBHARDT RONALD L.;TENNEY DOUGLAS A. |
分类号 |
H05K1/14;H05K7/14;(IPC1-7):H05K5/00;H05K5/04;H05K5/06 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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