发明名称 Nested plug-in modules
摘要 A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
申请公布号 US2002131249(A1) 申请公布日期 2002.09.19
申请号 US20020144619 申请日期 2002.05.13
申请人 GENERAL INSTRUMENT CORPORATION 发明人 FREDERICK STEVEN F.;SMEDLEY KIMBERLEY A.;GEBHARDT RONALD L.;TENNEY DOUGLAS A.
分类号 H05K1/14;H05K7/14;(IPC1-7):H05K5/00;H05K5/04;H05K5/06 主分类号 H05K1/14
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