| 发明名称 |
Integrated inductive circuits |
| 摘要 |
An integrated inductive element may be formed over a substrate. A trench may be defined in a variety of shapes in the substrate beneath the integrated inductive element in order to reduce eddy current losses arising from magnetic coupling between integrated inductors associated with the same integrated circuit.
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| 申请公布号 |
US6455915(B1) |
申请公布日期 |
2002.09.24 |
| 申请号 |
US20000618067 |
申请日期 |
2000.07.17 |
| 申请人 |
PROGRAMMABLE SILICON SOLUTIONS |
发明人 |
WONG TING-WAH |
| 分类号 |
H01L27/04;H01L21/02;H01L21/761;H01L21/822;H01L21/8234;H01L23/522;H01L27/08;H01L27/092;(IPC1-7):H01L29/00;H01L29/76 |
主分类号 |
H01L27/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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