| 摘要 |
PURPOSE: A multi-chip package for a semiconductor is provided to reduce an error rate in a package fabrication process by providing the multi-chip package for semiconductor bonded with an inner lead of a lead frame. CONSTITUTION: The first semiconductor chip(120) is adhered on a paddle including a lead frame(110) and a substrate by using an adhesive. The second semiconductor chip(130) is adhered on an upper face of the first semiconductor chip(120) by using the adhesive. A plurality of metal pads(150,155) are arranged on each edge of the first and the second semiconductor chips(120,130), respectively. The metal pad(150) of the first semiconductor chip(120) has a shape of right-angled tetragon. The metal pad(155) of the second semiconductor chip(130) has a shape of a regular quadrilateral. The metal pad(155) of the second semiconductor chip(130) is bonded with the metal pad(150) of the first semiconductor chip(120) by using a metal line.
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