| 摘要 |
PURPOSE: A method is provided which forms an electromagnetic shielding film on a plastic substrate by minimizing thermal strain of the plastic substrate and minimizing residual stress of a coating layer, and an electromagnetic shielding device manufactured by the method is provided. CONSTITUTION: The method for forming an electromagnetic shielding film on a plastic substrate comprises the steps of forming a multilayered plating film comprising a copper plating film and a nickel plating film on the surface of the plastic substrate so that linear resistance becomes 1 to 3 ohm (/¥Øcm), wherein the uppermost plating layer is the chromium plating film (S20); positioning a mask on which holes are perforated depending on desired patterns of a thin film on the plating film of the plastic substrate so as to form a gold (Au) thin film for electromagnetic shielding on the multilayered plating film; depositing a multilayered film comprising a single film of each materials or a combination of the single films on the multilayered plating film using a sputtering target consisting of one or more materials selected from nickel, chromium, alloy of nickel and chromium (stainless steel 304, 316, 309, 440) through the mask by magnetron sputtering so as to improve adhesion force between the plating film and a gold thin film (S30); and forming an electromagnetic shielding gold thin film on the adhesion force improved film by magnetron sputtering (S40).
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