发明名称 IC test system for testing BGA packages
摘要 An IC test system includes a socket having a plurality of contact pins, a positioning member for positioning an IC package for testing, a carriage arm for transferring the IC package positioned by the positioning member to the socket. The socket, positioning member and the carriage arm are fixed to the base of the test system via a common base plate. Vibration caused by the carriage arm is commonly transferred to the socket and the positioning member, whereby a suitable alignment of IC package with respect to the socket can be obtained.
申请公布号 US6462533(B1) 申请公布日期 2002.10.08
申请号 US20000723869 申请日期 2000.11.28
申请人 NEC MACHINERY CORPORATION 发明人 SHIMIZU JUN
分类号 G01R31/26;G01R1/04;G01R31/01;G01R31/28;(IPC1-7):G01R31/22 主分类号 G01R31/26
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