| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and instrument for measuring a warp in a semiconductor wafer, enhancing accuracy in warp measuring. SOLUTION: Air is blown into the front and rear faces of a silicon wafer W erected on a measuring reference surface, thereby keeping the wafer W vertical. Then, a warp in the wafer W is measured under this condition. Since the warp is measured in a torque-free state not causing any load for gripping the wafer W to act on the peripheral part of the wafer, the possibility of enlarging the warp due to differences in wafer grip positions can be removed, which has been a problem in gripping a wafer by using a conventional gripper. As a result, accuracy in warp measuring can be enhanced.
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