| 摘要 |
PROBLEM TO BE SOLVED: To provide both a nonhalogen and antimony-free epoxy resin molding material for sealing having good flame retardance without deteriorating reliability such as moldability, reflow and moisture resistances and high-temperature standing characteristics, and an electronic part device equipped with an element sealed with the epoxy resin molding material for sealing. SOLUTION: This epoxy resin molding material for sealing consists essentially of (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) red phosphorus coated with zinc oxide and a thermosetting resin. The electronic part device is equipped with the element sealed with the epoxy resin molding material for sealing.
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