SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to reduce thickness of package and to improve an integration degree by using spherical bumping ball having small diameter instead of a gold wire. CONSTITUTION: A PCB(Printed Circuit Board)(10) is provided with a hole(30), a conductive pattern(32) and a land(34). A first chip(12) is attached to the conductive pattern(32) via a spherical bumping ball(22). A second chip(14) is attached on the first chip by using an adhesive(36). A third chip(16) is stacked on the second chip and connected to the bumping ball(22) and the conductive pattern(32). A resin(26) is to mold the PCB(10), the second chip(14) and the bumping balls(22) so as to expose the bottom surface of the first chip(12) and the top surface of the third chip(16). A lead wire(24) is bonded to the land(34) of the PCB(10).