发明名称 |
Microprocessor heat sink retention module |
摘要 |
A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.
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申请公布号 |
US6483704(B2) |
申请公布日期 |
2002.11.19 |
申请号 |
US20010823625 |
申请日期 |
2001.03.29 |
申请人 |
INTEL CORPORATION |
发明人 |
ULEN NEAL;HANES CHRIS H.;UNREIN ED |
分类号 |
H05K7/14;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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