PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof is provided to reduce the number of layers of the printed circuit board and the size of package by integrating a heat-sink layer serving as a ground layer onto the printed circuit board. CONSTITUTION: A heat-sink panel(20) made of a metal having a superior heat transfer rate, is integrated onto a printed circuit board. A resin layer(40) acting as an insulator and a circuit pattern are provided on the heat-sink panel(20). The heat-sink panel(20) is provided with a plurality of the resin layers(40) and the circuit patterns. The circuit pattern is electrically connected to the heat-sink panel(20) through a via hole(54) formed on the resin layer(40). The heat-sink panel(20) serves a heat radiating function as well as a ground function.