| 摘要 |
PROBLEM TO BE SOLVED: To provide wiring for embedding an insulation film between wires without gaps, even if the aspect ratio of wiring is large, and to provide a formation method of the wiring. SOLUTION: The wiring 30 for electrical/magnetic circuits that is one embodiment is formed in a sectional shape having a side surface, that can receive radiation particles of a film-formed material with a surface. As the sectional shape, wiring 30B, whose bottom width is preferably wider than the upper width. Further specifically, as the sectional shape, a wiring 30A is preferred, having an inclined side, one portion of the upper section being perpendicular, and the remaining section inclined. Alternatively, as the sectional shape, a wiring 30C is preferred, having the entire side formed in a curved surface, and the bottom width is winder than the upper width.
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