ELECTROLESS PLATING METHOD FOR FINE PARTICLE

摘要

PROBLEM TO BE SOLVED: To obtain an uniform electroless plating film which has a desired film thickness under the accurate control while preventing the self-decomposition of a plating bath. SOLUTION: Fine particles subjected to Pd activation treatment are charged to the electroless plating bath in which the concentration of metallic ions is 0.1 to 1.5 g/L so that the surface area thereof is controlled to the ratio of 15 to 250 dm<2> /L to the plating bath, and the electroless plating is performed till the plating reaction is stopped without supplying a plating solution.