| 摘要 |
A wire analyzing device includes a source of radiation that irradiates a plurality of sensing elements. The source of radiation preferably is a laser beam and the sensing elements preferably are light sensitive devices that each provide an individual output indicating the amount of radiation incident on each sensing element. A wire sample is moved near the sensing elements so that it interrupts the radiation received by each sensing element. The output of each sensing element is utilized to determine any one or more of a number of desired characteristics of the wire sample. Example characteristics include the length and condition of an exposed, conductive portion of the wire, a position of an insulation shoulder, a position, orientation and condition of a seal member placed onto the wire.
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