发明名称 Potted electrical components and methods therefor
摘要 A potted electrical component and a manufacturing method therefor including at least one electrical component at least partially encapsulated in a potting compound. A basket is at least partially disposed between an outer surface of the potting compound and the electrical component. The potted electrical component may include a plate. The plate may have no electrical components, at least one integral electrical component, at least one electrical component mounted to the plate, or any combination thereof. Additionally, the basket may be attached to an assembly.
申请公布号 US2002191365(A1) 申请公布日期 2002.12.19
申请号 US20010882833 申请日期 2001.06.15
申请人 BYLER CURTIS J.;HARRISON CARL R. 发明人 BYLER CURTIS J.;HARRISON CARL R.
分类号 H05K5/00;H05K5/06;(IPC1-7):H05K5/06 主分类号 H05K5/00
代理机构 代理人
主权项
地址