| 发明名称 |
INSULATING LAYER FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD |
| 摘要 |
The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25° C. and the flexural modulus under heat at 250° C. |
| 申请公布号 |
US2016309582(A1) |
申请公布日期 |
2016.10.20 |
| 申请号 |
US201515101128 |
申请日期 |
2015.01.06 |
| 申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
TOMIZAWA Katsuya;CHIBA Tomo;ITO Meguru;SHIGA Eisuke |
| 分类号 |
H05K1/02;C08J5/04;H05K3/02;C08J5/24;H05K1/03;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An insulating layer for a printed circuit board having a difference of 20% or less between a flexural modulus at 25° C. and a flexural modulus under heat at 250° C. |
| 地址 |
Tokyo JP |
