发明名称 Testing vias and contacts in integrated circuit fabrication
摘要 A test arrangement is designed to test whether one in a chain of vias or contacts has abnormally high resistance. The arrangement contains a plurality of via or contact chains and a plurality of decoders. The chains are switchably connected to a resistance measurement device. Each decoder has a unique address such that it will generate a control signal when a predetermined address is address thereon. The control signal is used to close a switch, which connect one of the chains to the resistance measurement device. By sequentially applying different addresses to the decoders, the resistance of the chains can be individually measured.
申请公布号 US6503765(B1) 申请公布日期 2003.01.07
申请号 US20010920237 申请日期 2001.07.31
申请人 XILINX, INC. 发明人 CHAO TAI-AN;LING ZICHENG GARY;HSUEH SHIHCHENG
分类号 G01R27/02;G01R31/28;H01L21/66;H01L21/822;H01L23/544;H01L27/04;(IPC1-7):H01L21/66 主分类号 G01R27/02
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