发明名称 |
Testing vias and contacts in integrated circuit fabrication |
摘要 |
A test arrangement is designed to test whether one in a chain of vias or contacts has abnormally high resistance. The arrangement contains a plurality of via or contact chains and a plurality of decoders. The chains are switchably connected to a resistance measurement device. Each decoder has a unique address such that it will generate a control signal when a predetermined address is address thereon. The control signal is used to close a switch, which connect one of the chains to the resistance measurement device. By sequentially applying different addresses to the decoders, the resistance of the chains can be individually measured.
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申请公布号 |
US6503765(B1) |
申请公布日期 |
2003.01.07 |
申请号 |
US20010920237 |
申请日期 |
2001.07.31 |
申请人 |
XILINX, INC. |
发明人 |
CHAO TAI-AN;LING ZICHENG GARY;HSUEH SHIHCHENG |
分类号 |
G01R27/02;G01R31/28;H01L21/66;H01L21/822;H01L23/544;H01L27/04;(IPC1-7):H01L21/66 |
主分类号 |
G01R27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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