发明名称 ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To increase adhesion strength between a ceramics board and a silver conductor. SOLUTION: A silver conductor formed on a ceramics board is composed of silver, palladium, and glassy material. An electronic component is fixed on the silver conductor with solder mainly made of tin and silver or tin and bismuth.
申请公布号 JP2003008185(A) 申请公布日期 2003.01.10
申请号 JP20010185845 申请日期 2001.06.20
申请人 MEIDENSHA CORP 发明人 KOYAMA TETSUO
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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