| 摘要 |
Apparatus and techniques for implementing wireless communication between integrated transmitters and integrated receivers are provided. By providing a semiconductor structure including silicon and a compound semiconductor, a single circuit can be integrated part in silicon and part in compound semiconductor. In a semiconductor structure according to the invention, a wireless transmitter and a wireless receiver can be integrated in a compound semiconductor portion of the structure and digital CMOS circuitry can be integrated in the silicon portion of the structure. This obtains substantially increased wireless transmission efficiency. The circuits according to the invention can be implemented with circuits that wirelessly transmit from one portion of the chip to another portion of the chip, or with circuits that wirelessly transmit from one integrated circuit to a second integrated circuit.
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