发明名称 DUMMY BALL FOR BARREL PLATING
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive dummy ball for barrel plating free from Pb, which solves a problem of deformation in the dummy ball made from a Sn-based alloy so as not to contaminate a plating solution in barrel plating. SOLUTION: The dummy ball for barrel plating includes one or two sorts of Ag of 5 mass% or less or Cu of 2 mass% or less, of 0.1 mass% or more, and the balance substantially Sn. The dummy ball preferably includes Ni of 0.01 mass% or more but 0.5 mass% or less.
申请公布号 JP2003041397(A) 申请公布日期 2003.02.13
申请号 JP20010229607 申请日期 2001.07.30
申请人 HITACHI METALS LTD 发明人 DATE MASAYOSHI;SATO KOJI;KUBOI TAKESHI
分类号 B22D21/00;B22D25/02;B22D25/08;C22C13/00;C25D17/10;C25D17/12;C25D17/16;(IPC1-7):C25D17/12 主分类号 B22D21/00
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