发明名称 Polyamide resin composition
摘要 The present invention provides a polyamide resin composition suitable as industrial materials such as automobile parts, electronic or electrical parts, and industrial machine parts, and excellent in various mechanical properties such as various kinds of moldability, rigidity, and strength, and durability such as heat-resistant aging property. Namely, the invention relates to a polyamide resin composition comprising (A) a polyamide, (B) an apatite type compound, and (C) (i) a higher fatty acid metal salt and/or (ii) a mixture of a metal halide and a copper compound, wherein the polyamide resin composition is obtainable by adding component (C) after the formation of the apatite type compound.
申请公布号 US2003045621(A1) 申请公布日期 2003.03.06
申请号 US20010958982 申请日期 2001.10.16
申请人 ARAMAKI MASSAKI;WATANABE KATSUSHI;NAKASHIMA IKUTOSHI 发明人 ARAMAKI MASSAKI;WATANABE KATSUSHI;NAKASHIMA IKUTOSHI
分类号 C08K3/32;C08K5/098;(IPC1-7):C08K5/04;C08K3/34 主分类号 C08K3/32
代理机构 代理人
主权项
地址
您可能感兴趣的专利