| 摘要 |
PROBLEM TO BE SOLVED: To provide a such a structure that surely sucks a solder ball and transfers it onto the specified electrode position of an electronic part in a mask for sucking a solder ball that is attached to a solder ball sucking device. SOLUTION: This mask 5 for sucking a solder ball is attached to a sucking device body that sucks a solder ball by vacuum and mounts it onto an electrode of an electronic part, and it is provided with a plurality of through holes for sucking the solder ball on the specified position. The through hole is provided with a funnel-like suction area 13 narrowing from the main surface of the mask for receiving the solder ball through suction toward the side of a suction port 12, and an air-suction space 16 that is communicated with the suction port 12 of the suction area and reaches a suction hole with a larger diameter than the suction port 12 formed on the rear surface of the mask connecting with the sucking device. Thus, the solder balls are held one by one in the suction areas 13, and suction pressure is increased by narrowing from the suction space 16 to the suction port, thereby surely sucking the solder ball in the suction area 13.
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