Package for a discrete device and manufacturing method of the same

摘要

A lead frame having a terminal portion 12 for connection which is connected thereto by a lead portion 21 is prepared, and a heat-resistant tape 24 for preventing a burr of resin is attached to a back surface of the lead frame 20. A discrete device 11 having a back surface thereof metallized is loaded on the heat-resistant tape 24 from a front surface thereof. An electrode 11a disposed on an upper surface of the discrete device 11 and the terminal portion 12 of the lead frame 20 are wire-bonded by a wire 13. An outer peripheral region surrounding the discrete device 11, the terminal portion 12 of the lead frame 20 and the wire 13 is encapsulated by a molding resin 14. Then, the heat-resistant tape 24 is released and the molding resin 14 is separated into pieces by dicing.