| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of a camera module, in which unwanted light is not made incident on the light-receiving face of an image pickup element, even if respective members including a substrate used for mounting the image pickup element have transmittance. SOLUTION: The image pickup element 4 is flip-flop mounted on the substrate 2 where a through-hole 2a is made. A lens unit, having a lens 6 facing the light-receiving face 4a of the image pickup element 4 through the through-hole, is fitted to a side opposite to the image pickup element of the substrate 2. A resin part 20A constituted of opaque resin, is disposed near the inner face of the through-hole 2a. Thus, transmitted light which is made incident on the through-hole 2a is interrupted.
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