发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device has a first substrate provided with a photoelectric converter on its primary face, a first wiring structure having a first bonding portion which contains a conductive material, a second substrate provided with a part of a peripheral circuit on its primary face, and a second wiring structure having a second bonding portion which contains a conductive material. In addition, the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. Furthermore, the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films.
申请公布号 US2016322415(A1) 申请公布日期 2016.11.03
申请号 US201615209605 申请日期 2016.07.13
申请人 CANON KABUSHIKI KAISHA 发明人 Shimotsusa Mineo
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项 1. A device comprising: a first substrate provided with a first transistor; a first wiring structure which is disposed on the first substrate and which has a first conductive portion and a first insulating film, the first conductive portion containing a conductive material and being connected a first circuit including the first transistor via a wiring of the first wiring structure; a second substrate provided with a second transistor; and a second wiring structure which is disposed on the second substrate, and which has a second conductive portion and a second insulating film, the second conductive portion containing a conductive material and being connected to a second circuit including the second transistor via a wiring of the second wiring structure, wherein the first wiring structure and the second wiring structure are disposed between the first substrate and the second substrate, and the first conductive portion and the second conductive portion are connected to each other; and the device further comprising at least one of: a first diffusion preventing film which has a portion positioned between the first insulating film and the second conductive portion, and prevents a diffusion of the conductive material of the second conductive portion; and a second diffusion preventing film which has a portion positioned between the second insulating film and the first conductive portion, and prevents a diffusion of the conductive material of the first conductive portion.
地址 Tokyo JP