| 发明名称 |
SEMICONDUCTOR DIE ASSEMBLY AND METHODS OF FORMING THE SAME |
| 摘要 |
Semiconductor die assemblies and methods of forming the same are described herein. As an example, a semiconductor die assembly may include a thermally conductive casing, a first face of a logic die coupled to the thermally conductive casing to form a thermal path that transfers heat away from the logic die to the thermally conductive casing, a substrate coupled to a second face of the logic die, and a die embedded at least partially in a cavity of the substrate. |
| 申请公布号 |
US2016322340(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201514700222 |
申请日期 |
2015.04.30 |
| 申请人 |
Micron Technology, Inc. |
发明人 |
Li Jian;Groothuis Steven K. |
| 分类号 |
H01L25/18;H01L23/498;H01L23/367;H01L23/00;H01L25/00;H01L21/56;H01L23/31;H01L25/065;H01L23/538 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor die assembly, comprising:
a thermally conductive casing; a first face of a logic die coupled to the thermally conductive casing to form a thermal path that transfers heat away from the logic die to the thermally conductive casing; a substrate coupled to a second face of the logic die; and a memory die embedded at least partially in a cavity of the substrate. |
| 地址 |
Boise ID US |
