| 发明名称 |
PRINTED WIRING BOARD, METHOD FOR PRODUCING PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE |
| 摘要 |
The present invention provides a printed wiring board comprising: a conductor circuit on an insulating substrate, a white solder resist layer which is composed of a photosensitive resin composition on the insulating substrate having the conductor circuit, and a protective layer which is composed of a silicone resin composition on the white solder resist layer. The inventive printed wiring board shows superior thermo-discoloration resistivity and excellent patterning resolution. |
| 申请公布号 |
US2016322293(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201615082675 |
申请日期 |
2016.03.28 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KIMURA Saiko;HAMAMOTO Yoshihira;KASHIWAGI Tsutomu |
| 分类号 |
H01L23/498;H05K1/03;H05K3/18;H01L21/027;H01L21/288;H05K3/00;H05K1/11;H01L21/48 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed wiring board comprising: a conductor circuit on an insulating substrate, a white solder resist layer which is composed of a photosensitive resin composition on the insulating substrate having the conductor circuit, and a protective layer which is composed of a silicone resin composition on the white solder resist layer. |
| 地址 |
Tokyo JP |
