| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor having excellent characteristics of mold releasability and reliasability. SOLUTION: This epoxy resin composition for sealing the semiconductor consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler, (D) a curing accelerator and (E) a compound represented by general formula (1) (wherein, R1 to R5 are each a 1-4C alkyl group or hydrogen). In the resin composition, the compound represented by general formula (1) is contained in an amount of 0.01-3 wt.% in the whole epoxy resin composition.
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