| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for treating a wafer having merits of a wafer transfer method of one-by-one and merits of a batch transfer method. SOLUTION: The semiconductor manufacturing apparatus transfers the wafer between a cassette for housing the wafer and a boat for supporting the wafer at the time of processing and processes the wafer supported in the boat in a reaction chamber. The apparatus comprises a required number of plates for transferring the wafer in a vertical direction above a rotatable and vertically movable rotary base in such a manner that the plate is retractably provided on the base. In the apparatus, the required number of the supporting plates transfer the wafers between the cassette and the boat by a wafer transfer unit having the plurality of the plates for transferring a plurality of the wafers at once together with the plate 38 for transferring the sheets and the plates 39, 40, 41 and 42 for transferring the sheets one by one at once the wafers by the required number of the supporting plates, and the pitch between the plats is changed in the vertical direction of other plate and with the plates for transferring the sheets at the time of transferring the wafer as a reference of the other plate. |
