发明名称 TREATING SYSTEM
摘要 PROBLEM TO BE SOLVED: To check the influence upon and upstream processing section or a substrate to be processed to the minimum even when a process flow stagnates at a portion in a system. SOLUTION: In an upstream multistage unit section 44, heating units 52 and 54 and an adhesion unit 56 are piled up in a multiple stage on a path unit 50 and one or a plurality of buffer units 67(1)-67(3) is piled up in a multiple stage under the path unit 50. In a downstream multistage unit section 48, cooling units 62 and 64 and an adhesion unit 66 are piled up in a multiple stage on the path unit 50, and one or a plurality of buffer units 67(4)-67(6) is piled up in a multiple stage under a path unit 60. A transporting mechanism 46 carries a substrate in and out of an arbitrary unit in the multistage unit sections 44 and 48 adjoining the mechanism 46 on both sides of the mechanism 46 by performing access to the unit by vertically moving or rotating. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003168713(A) 申请公布日期 2003.06.13
申请号 JP20010367010 申请日期 2001.11.30
申请人 TOKYO ELECTRON LTD 发明人 TAGAMI SHINYA;HAYASHI MAKOTO;SAKATA TOMIHIRO
分类号 B65G49/07;B65G49/06;G02F1/13;H01L21/00;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/07
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