发明名称 |
Cross-diffusion resistant dual-polycide semiconductor structure and method |
摘要 |
A dual-polycide semiconductor structure and method for forming the same having reduced dopant cross-diffusion. A conductive layer is formed over a polysilicon layer having a first region doped with a first dopant and a second region adjoining the first region at an interface doped with a second dopant. A region of discontinuity is then formed in the conductive layer located away from the interface. The conductive layer formed over the polysilicon gate overlaps the interface to provide electrical continuity between the first and second regions of the polysilicon gate, but also includes a region of discontinuity to reduce dopant cross-diffusion.
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申请公布号 |
US6583518(B2) |
申请公布日期 |
2003.06.24 |
申请号 |
US20010945380 |
申请日期 |
2001.08.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
TRIVEDI JIGISH D.;WANG ZHONGZE;ABBOTT TODD R.;CHO CHIH-CHEN |
分类号 |
H01L21/8244;H01L27/11;(IPC1-7):H01L27/11 |
主分类号 |
H01L21/8244 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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