| 摘要 |
PURPOSE: A wire bonding apparatus is provided to be capable of smoothly and accurately carrying out a wire bonding process and preventing the contact between a rail and a lead frame when a bonding process is processed by improving the structure of the wire bonding apparatus. CONSTITUTION: A pair of grippers is installed for holding the edge portion of a lead frame. A front and rear rail(11,12) capable of being moved are installed and spaced apart from each other for transferring the grippers along the rails. A heating block(16) capable of moving up and down, is installed at the lower portion of the rails for carrying out a wire bonding process. A window clamp(15) capable of moving up and down, is installed at the upper portion of the rails for carrying out the wire bonding process. A driving part is installed for controlling the interval between the rails. |
