发明名称 METHOD FOR PREPARING EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND THE EPOXY RESIN COMPOSITION
摘要 PURPOSE: Provided are an epoxy resin composition which is formed by fine dispersing a low molecular weight wax component in a biphenyl epoxy resin, and thus has both adhesion and excellent mold releasing property, and a method for preparing the same. CONSTITUTION: The method comprises the steps of (i) completely fusing a phenol novolac-based curing agent in a reactor maintained at 120-140 deg.C, slowly adding 50-130 parts by weight of biphenyl epoxy resin(with respect to 200 parts by weight of the phenol novolac-based curing agent), fusion-mixing the curing agent and the biphenyl epoxy resin at the above temperature range for 20-60 minutes, and quenching the mixture at low temperature so as to obtain a resin masterbatch, and (ii) fusion-mixing the resin masterbatch with other components to obtain a final resin composition.
申请公布号 KR20030057086(A) 申请公布日期 2003.07.04
申请号 KR20010087459 申请日期 2001.12.28
申请人 CHEIL INDUSTRIES INC. 发明人 BAE, GYEONG CHEOL;KIM, DAE GON;PARK, JEONG JIN;YOO, JE HONG
分类号 C08L63/02 主分类号 C08L63/02
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