| 摘要 |
PURPOSE: A sputtering target is provided which is capable of forming a homogeneous coating film on substrate by preventing particle from sticking to target material. CONSTITUTION: The sputtering target comprises a target material(14-a) equipped with particle accumulation means; and a backing plate as a support on which the target material is rested, wherein the particle accumulation means is formed by blast treating the central part of the target material surrounded by erosion region (E), wherein the particle accumulation means is formed by blast treating the bottom surface of the groove having large width after forming a groove having large width on the central part of the target material surrounded by erosion region (E), wherein the particle accumulation means is formed by coating a metallic material solder on the bottom surface of the groove having large width after forming a groove having large width on the central part of the target material surrounded by erosion region (E), and wherein the particle accumulation means is formed by spray coating the bottom surface of the groove having large width after forming a groove having large width on the central part of the target material surrounded by erosion region (E). |
