发明名称 HEAT-BONDABLE FILAMENT
摘要 PROBLEM TO BE SOLVED: To provide a heat-bondable filament which scarcely changes the dimension when subjected to a heat bonding treatment in a post process or the like, has an excellent processing property, scarcely lowers the strength after the thermal treatment, and can suitably be used for the uses of industrial materials requiring high strength. SOLUTION: This heat-bondable filament is characterized by comprising a polyester and a copolyester having a melting point of 130 to 220°C being lower than that of the polyester as a core component and a sheath component, respectively, constituting the filament, and having strength of≥4.0 cN/dtex, a breaking elongation of≤30%, a dry-heat shrinkage of≤20% at 150°C, and the maximum thermal stress of≤0.2 cN/dtex up to the (melting point + 10)°C of the sheath component. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003201627(A) 申请公布日期 2003.07.18
申请号 JP20010400288 申请日期 2001.12.28
申请人 UNITICA FIBERS LTD 发明人 MIYAZAKI SHUJI;ISHIBAI SHIRO
分类号 D01F8/14;(IPC1-7):D01F8/14 主分类号 D01F8/14
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