SURFACE TREATMENT METHOD FOR FLUORORESIN AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD OBTAINED BY USING FLUORORESIN

摘要

PROBLEM TO BE SOLVED: To improve the adhesive strength of wiring on a printed circuit board in a method of producing a printed circuit board obtained by using fluororesin. SOLUTION: A fluororesin board 1 obtained by using fluororesin (PTFE: polytetrafluoroethylene) as a base is dipped into a metallic sodium-naphthalin complex-containing solution. Fluorine is released from the surface of the fluororesin board, and a hydrophilic group is introduced therein, and hydrophilization treatment is performed. Oxygen plasma treatment is performed to the surface of the hydrophilization-treated fluororesin board. Wiring consisting of metallic films 3 to 6 is formed on the surface of the fluororesin board. COPYRIGHT: (C)2003,JPO